[DOWNLOAD] "Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement" by Yue Ma & Christian Gontrand # eBook PDF Kindle ePub Free

📘 Read Now     📥 Download

eBook details

• Title: Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
• Author : Yue Ma & Christian Gontrand
• Release Date : January 08, 2019
• Genre: Network,Books,Computers & Internet,Professional & Technical,Engineering,Electrical Engineering,
• Pages : * pages
• Size : 29389 KB

Description

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

Free Books Download "Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement" PDF ePub Kindle